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ZiZhu Hi-tech Park, No.555 Dongchuan Rd. Minhang District, Shanghai
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ZiZhu Hi-tech Park, No.555 Dongchuan Rd. Minhang District, Shanghai
1.Responsible for the daily maintenance of Linux servers.
2.Responsible for the maintenance of the R&D intranet, including configuration, debugging, upgrading, and monitoring of network devices.
3.Responsible for the optimization of file systems, high-performance networks, and Linux systems.
4.Cooperate with CAD to upgrade EDA and manage permissions.
1.Bachelor's degree or above in Electronics.
Communications, Computer Science, or related fields.
2.5+ years of experience in Linux IT operations.
3.Familiarity with operations tools such as Ansible.
4.Familiarity with monitoring systems such as Zabbix, Prometheus, or Nagios.
5.Experience in deploying High-Performance Computing (HPC) environments.
6.Proficiency in at least one distributed file system, such as GlusterFS, Ceph, BeeGFS, or Lustre.
7.Proficiency in at least one local file system, such as EXT4, XFS, or ZFS.
8.Familiarity with RDMA deployment, such as RoCE.
9.Experience in deploying LDAP, Windows AD domain, and Kerberos.
10.Preference given to candidates with experience in scripting languages such as shell, Python, or Perl.
11.Preference given to candidates with experience in distributed job management tools such as SGE, LSF, or OpenLava.
12.Strong work ethic, positive attitude, and excellent communication and teamwork skills.
1.Complete the design of analog circuits, such as PMU (Power Management Unit), ADC (Analog-to-Digital Converter), and interface modules in ASIC or analog chips.
2.Collaborate with Layout Engineers to complete floor planning, layout optimization, and post-layout verification.
3.Assist Test Engineers in developing test plans.
4.Support AE (Applications Engineer) / FAE (Field Applications Engineer) in resolving issues encountered by customers.
1.Master's degree or above in Microelectronics, Electronic Engineering, or related fields.
2.Over five years of working experience.
3.Experience in designing power management modules or chips, such as BUCK, BOOST, LDO (Low Dropout Regulator), LED Driver, Motor Driver, Charge Pump, Class D amplifiers, and high-voltage design.
4.Experience in designing signal chain modules or chips, such as ADC, DAC (Digital-to-Analog Converter), OPA (Operational Amplifier), and active filters.
5.Experience in designing interface and clock modules or chips, such as SerDes (Serializer/Deserializer), CMU/PLL (Clock Management Unit/Phase-Locked Loop), LIN/CAN PHY (Local Interconnect Network/Controller Area Network Physical Layer).
6.ESD (Electrostatic Discharge) design experience, including low-voltage and high-voltage ESD circuits and ESD device design.
7.Preference given to candidates with experience in automotive-grade circuit development.
1.Collaborate with chip designers to define the design-for-testability (DFT) architecture.
2.Responsible for DFT-related tasks in SoC chips, including Scan, MBIST (Memory Built-In Self-Test), ATPG (Automatic Test Pattern Generation), Boundary Scan, etc.
3.Conduct ATE (Automatic Test Equipment) testing after tape-out, including vector debugging, coverage optimization, and troubleshooting various issues encountered during testing.
1.Bachelor's degree or above, with more than 3 years of experience in digital or DFT design.
2.Familiarity with boundary scan logic, ATPG (Automatic Test Pattern Generation), MBIST (Memory Built-In Self-Test) logic, and mixed-signal testing.
3.Proficient in Verilog design language.
4.Proficient in scripting languages such as TCL, Perl, and Python.
5.Familiarity with D toolsFT; preference given to candidates with experience in using MODUS.
1.Based on the chip product planning feedback from the company's market/business development department, be responsible for the product definition and management of automotive motor control SoC, Driver, Pre-driver, and (or) power ICs (high/low-side drivers, ASICs, domain control power ICs). Coordinate with application, R&D, and operations departments to complete chip requirement decomposition and design, and follow up on the entire product process.
2.Spend part of the time (in collaboration with other colleagues) supporting customer presentations, exhibitions, capturing and organizing customer requirements, following up on major projects with top-tier customers, and engaging with industry associations and ecosystems.
1.Bachelor's degree or above.
2.Background in motor control or automotive power IC chip applications (PM, marketing, AE, FAE) or design experience (outgoing personality and smooth communication skills); experience in product management or product definition is preferred.
3.Familiarity with chip R&D design, ATE (Automatic Test Equipment), packaging, and testing processes; knowledge of automotive chip development.
1.Lead a process R&D team focused on BCD (Bipolar-CMOS-DMOS) process development for the company.
2.Develop process development plans and strategies, and track the latest trends and advancements in the industry.
3.Design new devices, conduct TCAD (Technology Computer-Aided Design) simulations, and create test structures.
4.Integrate process flows, design process experiments, and test and analyze device parameters.
5.Assist in resolving process-related issues in product design, and improve the yield and reliability of mass-produced products.
6.Manage the team to ensure timely project completion. Responsible for recruitment, training, and performance evaluation of team members.
1.Master's degree in Microelectronics, Integrated Circuits, Physics, Materials Science, or related fields.
2.Over 10 years of experience in process and device development, with in-depth understanding of device physical characteristics and expertise in BCD processes.
3.Strong logical thinking, analytical skills, and communication abilities. Self-motivated, with management experience preferred.
4.Experience working in a Fab (fabrication facility) or IDM (Integrated Device Manufacturer) company in device and process development. Preference given to candidates with eFlash (embedded flash) related experience.
1.Responsible for the schematic design and PCB layout of hardware test boards.
2.Responsible for the soldering (hand soldering) of PCB circuit boards.
3.Verify the accuracy of components on the single board designed by electronic engineers and assist with procurement.
4.Possess good communication skills to promptly identify and report soldering issues to engineers, and assist with some chip testing tasks.
5.Complete other tasks assigned by the supervisor.
1.Proficient in using hardware design software AD (Altium Designer) to design schematics and PCBs.
2.Skilled in circuit board soldering techniques and able to correctly identify various electronic components.
3.Proficient in using tools such as soldering irons and hot air guns, and experienced in soldering through-hole, surface-mount components, and IC chips. Familiar with various test equipment, including power supplies, multimeters, and oscilloscopes.
4.Hardworking, detail-oriented, and responsible. Possess a strong sense of responsibility and a willingness to take on tasks diligently.
1.Design and optimize algorithms for ultrasonic echo signal processing.
2.Collaborate closely with the chip development team to support the implementation and verification of algorithms.
3.Focus on echo signal processing for ultrasonic or radar applications.
1.Bachelor's degree or above in Electronic Engineering, Computer Science, Automation, or related fields.
2.Over 3 years of experience in digital signal processing, with preference given to those with experience in ultrasonic signal processing.
3.Proficient in using Matlab for algorithm simulation and verification.
4.Familiar with the development processes of digital chips, such as FPGAs (Field-Programmable Gate Arrays) and DSPs (Digital Signal Processors).
5.Strong team spirit and communication skills, with the ability to communicate effectively within a team.
6.Ability to quickly learn and adapt to new technologies.
1.Full-time associate degree or above in Electronics, Communications, or related fields.
2.Basic knowledge of electronic circuits and electromagnetic field theory is preferred.
3.Understanding of EMC (Electromagnetic Compatibility) standards and familiarity with EMC test instruments and principles is preferred.
4.Over one year of experience in EMC testing of automotive components or chips is preferred.
5.Ability to solder PCB boards and components such as ICs is preferred.
6.Proficient in using conventional test equipment, such as oscilloscopes.
1.Complete EMC Testing for Chips: Conduct electromagnetic compatibility (EMC) tests on chips and provide effective test data in a timely manner.
2.Assist in EMC Failure Analysis: Support the analysis of EMC failures in customer products and provide improvement suggestions.
3.Conduct ESD Testing and Analysis: Assist in ESD (Electrostatic Discharge) testing and analysis at both chip and PCB levels.
4.Other Tasks: Complete other tasks assigned by the supervisor.
1.Lead and coordinate projects from post-tapeout to mass production for chips, collaborating with IC design, test engineers, system engineers, and other stakeholders to develop plans based on market demands and product status. Organize phase-specific reviews and approvals.
2.Develop and execute reliability/burn-in plans for new products, prepare reliability samples, and drive reliability validation.
3.Oversee engineering sample delivery and collaborate with the quality team to complete gate reviews for transitioning from engineering to mass production.
4.Track and improve low-yield issues in engineering batches (CP, Assembly, FT) and drive yield enhancement for mass production.
5.Assist in evaluating optimal packaging/testing solutions and cost estimation for new products.
6.Support the quality team in customer complaint analysis, customer audits, and supplier audits.
7.Collaborate with marketing and R&D teams to finalize new product designs.
1.Full-time bachelor’s degree or higher in Microelectronics, Electronics, or related fields, with 3+ years of experience in automotive electronics.
2.Deep understanding of automotive reliability standards (e.g., AEC-Q100/006).
3.Experience in independently designing AEC-Q test hardware is a plus.
4.End-to-end automotive product engineering experience is preferred.
5.Excellent communication skills in both Chinese and English.
6.Clear career goals, strong ambition, exceptional verbal/written communication, keen insight, and strong logical, analytical, and problem-solving skills.
7.Integrity, self-motivation, accountability, strong ethics, teamwork spirit, and ability to thrive under pressure.
1.Perform RTL verification, formal verification, and timing verification.
2.Develop verification test plans for the assigned modules.
3.Conduct front-end and back-end simulation and validation for the assigned modules, and complete verification reports.
4.Participate in developing DVT (Design Verification Testing) and ATE (Automatic Test Equipment) test plans for the assigned modules, and define test specifications.
5.Handle test feedback related to the assigned modules, and analyze and resolve issues.
1.Bachelor's degree or above in Microelectronics, Electronic Information, or related fields.
2.At least 3 years of relevant experience.
3.Familiarity with the basic principles of digital integrated circuits, verification techniques, verification processes, and related tools.
4.Proficient in using System Verilog to build testbenches.
5.Experience with UVM (Universal Verification Methodology) for digital verification platforms.
6.Familiarity with scripting languages such as Shell, Perl, Ruby, and Python.
7.Experience in automotive-grade chip development is a plus.
1.Proactively connect with customer technical teams to fully understand their product and technical requirements. Develop appropriate product and technical solution strategies, and identify new opportunities on the client side.
2.Organize pre-sales technical exchanges, training, and Q&A sessions tailored to customer needs. Timely resolve on-site technical issues for customers.
3.Manage after-sales issues related to chips, including information collection and preliminary analysis, and assist quality engineers in resolving after-sales quality issues.
4.For challenging technical solutions and issues, promptly organize assessments and analyses with product and R&D teams, and provide effective solutions.
5.Regularly summarize application issues of end-products, and author application documents and reports.
6.Participate in the joint development of key projects with major customers.
1.Bachelor's degree or above in Electronics, Automation, Communications, Computer Science, or related fields.
2.Familiarity with embedded system software development tools, microcontroller architectures, and common peripherals.
3.Over 3 years of experience in embedded hardware and software development, with proficiency in C language programming.
4.Strong foundation in analog and digital circuitry, with excellent system analysis and debugging skills.
5.Strong problem-solving and stress-resistant capabilities, good communication skills, and a strong team spirit.
6.Willingness to continuously learn new technologies and adapt to regional business trips as needed.
1.Maintain relationships with automotive manufacturers in the designated area and promote chip products.
2.Manage local agents and be directly or indirectly responsible for the sales of automotive-grade chips in the region.
3. Identify and develop new business opportunities, coordinating company resources to meet customer needs, including pre-sales and post-sales support.
4.Collaborate with the Sales Director to set sales targets and strive to achieve them.
5.Handle customer quotations, forecast customer demands, negotiate customer orders, and manage deliveries.
6.Work with the company's product planning department to conduct customer demand surveys and define specifications for new products.
1.Associate degree or above, with proficiency in office software.
2.Over 3 years of experience in the automotive electronics industry; experience working with automotive manufacturers is preferred.
3.Ability to independently discuss and communicate basic requirements with customer engineers.
4.Capable of working independently and open to a Home Office work model.
1.Understand the specifications of the company's chips (including competitors') and collaborate with designers to develop test plans and requirements for the chips.
2.Based on the chip test plans and requirements, be capable of designing simple test board schematics and PCB layouts.
3.Assist AE/FAE in providing reference design guidance and resolving issues encountered by customers during chip application.
4.Support ATE personnel in addressing various issues encountered in mass production testing.
5.Write and organize technical documents, including test reports, BUG/FA analysis reports, and summary reports.
1.Bachelor's degree in Electronic Engineering (or related field) with at least 3 years of experience in chip testing.
2.Familiarity with hardware circuit schematic design.
3.Proficiency in using CAD design software such as Cadence or Altium Designer.
4.Proficient in using test instruments like spectrum analyzers, oscilloscopes, and signal sources. Preference given to those who can program and automate test platforms using these instruments.
5.Strong foundation in analog and digital circuits, with familiarity in chip testing principles and processes.
6.Proficient in at least one programming language (e.g., C, Python).
7.Experience in testing automotive-grade chips is preferred.
8.Excellent communication skills and a strong sense of teamwork.
1.Collaborate with marketing and sales departments to identify customer technical requirements. Responsible for breaking down the technical specifications and functionalities of future products, refining technical indicators and functional needs.
2.Build prototypes for future products, identify functionalities and technical specifications, and provide clear guidance on chip design technical indicators and functional requirements.
3.Analyze the technical specifications of competing products, comparing and identifying their technical indicators, functionalities, and other technical details.
4.Conduct research on industry application algorithms or implementation methods, and explore new technological directions.
1.Bachelor's degree or above in Electronics, Automation, or related fields.
2.Practical experience in embedded software development, familiar with relevant regulations or standards in automotive embedded development.
3.Proficient in C language development, familiar with various IDE development platforms such as Keil, IAR, GCC, and knowledgeable about mainstream automotive-grade MCU products.
4.Familiar with circuit design and CAD tools such as AD/Cadence, and proficient in using testing instruments like oscilloscopes and spectrum analyzers.
5.Strong language expression and communication abilities.
6.Over 5 years of relevant work experience.
· Layout Design:
o Create and optimize physical layouts specifically for BCD processes, integrating Bipolar, CMOS, and DMOS devices within a single chip.
o Utilize advanced EDA tools to design layouts that maximize the advantages of BCD technology, including high-voltage capabilities, low power consumption, and high integration density.
· Collaboration:
o Work closely with circuit designers and other engineering teams to understand design intent and ensure that layouts meet performance, reliability, and manufacturability targets.
o Provide feedback and suggestions to enhance the design and layout processes, leveraging your BCD process expertise.
· DRC/LVS and Verification:
o Conduct rigorous Design Rule Checks (DRC) and Layout Versus Schematic (LVS) verifications to ensure layout accuracy and compliance with BCD process specifications.
o Perform electrical and thermal simulations to validate layout performance and identify potential issues early in the design cycle.
· Manufacturability Considerations:
o Collaborate with process engineers to ensure that layouts are compatible with BCD process flows, including deep trench isolation, high-voltage well implants, and other critical process steps.
o Optimize layouts for yield enhancement and cost reduction, leveraging your knowledge of BCD process variability and defects.
· Documentation and Tape-Out:
o Maintain comprehensive documentation of layout designs, modifications, and verification results.
o Prepare design data for tape-out, including GDS-II stream generation and verification, ensuring compliance with BCD process and foundry requirements.
Qualifications:
· Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field. Master’s degree is preferred.
· Experience: Experience with high voltage and high precisions layout.
· Technical Skills:
o Strong understanding of basic circuit structures.
o Knowledge of semiconductor processing and effects to layout.
o Familiar with semiconductor device structure and parasitic device.
o Have good knowledge of ESD and Latch Up mechanics.
o Have ability to handle negative voltage in SoC chips.
o Proficiency in EDA tools such as Virtuoso and Calibre.
· Soft Skills:
o Excellent problem-solving and analytical skills, with the ability to troubleshoot complex layout issues.
o Strong communication and teamwork abilities, able to collaborate effectively with cross-functional teams.
o Ability to work independently and manage multiple tasks in a fast-paced environment, while maintaining attention to detail and commitment to quality.
1.Conduct testing and assessment of system application solutions for new products in the automotive product line, and analyze competing products.
2.Collaborate with the chip design team to perform system-level testing and validation.
3.Develop system-level models for product applications.
4.Assist AE/FAE in resolving issues encountered by customers.
5.Write and maintain documentation related to product development and promotion.
1.Bachelor's degree or above in Electronic Information Engineering or related fields.
2.Familiarity with modeling tools such as Simplis/PSPICE is preferred.
3.Knowledge or expertise in DC-DC converter topologies, including but not limited to BUCK, BOOST, BUCK-BOOST.
4.Basic ability to debug software.
5.Familiarity or expertise in various electronic components and devices.
6.Strong communication skills, a detail-oriented and diligent work attitude, and a passion for technology.
7.Outstanding recent graduates are also considered.
1.Collaborate with RD (Research & Development) and AE (Applications Engineering) to develop chip test plans.
2.(Circuit Probing) and FT (Final Test) test programs.
3.Design peripheral circuit schematics and guide Loadboard/Socket/Probecard vendors to design hardware that meets mass production requirements.
4.Conduct product validation during the engineering phase and collect and analyze test data.
5.Improve test coverage, optimize test methods to enhance test efficiency and yield.
1.Bachelor's degree or above in Communications, Computer Science, Electronics, Automation, or related fields.
2.Understanding of chip testing theories. Experience in mixed-signal SoC (System on Chip) project development is preferred.
3.Familiarity with ATE (Automatic Test Equipment) development processes. Experience with 93K/Chroma series platforms is preferred.
4.Proficiency in programming languages such as C++ and Perl.
5.Strong team spirit and excellent communication skills.
1.Responsible for device architecture design, process implementation, DOE (Design of Experiments) design, device performance enhancement, process reliability improvement, and model wafer delivery.
2. Independently managed the design and development of BCD (Bipolar-CMOS-DMOS) devices, with in-depth knowledge of 8-12 inch BCD device manufacturing processes and technical parameters. Possesses extensive experience in BCD product mass production.
3.Experienced in designing DOE experiments, collaborating with foundries to adjust process flows based on product requirements, and optimizing key parameters through trade-off analysis.
4.Capable of conducting electrical testing and physical structure analysis of key BCD device parameters, as well as simulating electrical parameters. Familiar with the BCD switching process.
5.Assist in WAT (Wafer Acceptance Test) testing, yield improvement, and failure analysis for products.
6.Design device rules according to technical node requirements and tune devices to meet target specifications. Collaborate with R&D to minimize device area and reduce mask layers while meeting product design needs.
7.Proficient in using layout software to design devices and perform LO (Layout Optimization) and DRC (Design Rule Check).
8.Familiarity with EFlash process devices is a plus.
1.Over 10 years of experience in semiconductor device research and development.
2.Master's degree or above in Microelectronics, Semiconductor, Theoretical Physics, or related fields.
3.Familiarity with semiconductor device theory, semiconductor manufacturing processes, device layout, TCAD simulation software, and device optimization methods.
4.Strong theoretical analysis and problem-solving abilities.
5.Excellent communication skills and a strong team spirit.
6.Respect for technology, a pragmatic approach, a commitment to continuous learning, and a drive for innovation and breakthroughs in this role.
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